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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | Raspberry Pi | |
| Mounting Technique | Thermal Tape, Adhesive (Included) | |
| Physical Shape Form | Rectangular | |
| Linear Length Dimension | 0.520" (13.20mm) | |
| Horizontal Width Dimension | 0.476" (12.10mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | - | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | - | |
| Passive Cooling Resistance | - | |
| Construction Material Type | Copper | |
| Surface Material Treatment | - |
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