Attribute
Description
Manufacturer Part Number
FIT0506
Manufacturer
Description
PURE COPPER HEATSINK PACK OF 5 (
Manufacturer Lead Time
4 weeks

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Product Attributes

Type Description
Category
Import Duty Classification Tariff may apply if shipping to the United States
Product Series Line LattePanda
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Top Mount
Thermal Package Design Assorted (BGA, LGA, CPU, ASIC...)
Mounting Technique Thermal Tape, Adhesive (Included)
Physical Shape Form Rectangular
Linear Length Dimension 0.520" (13.20mm)
Horizontal Width Dimension 0.480" (12.19mm)
Circular Measurement -
Heat Sink Fin Elevation 0.189" (4.80mm)
Power at Temp Increase -
Thermal Resistance with Fan -
Passive Cooling Resistance -
Construction Material Type Copper
Surface Material Treatment -