Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 6160 | ₹ 51.79000 | ₹ 3,19,026.40 |
| 1540 | ₹ 55.75000 | ₹ 85,855.00 |
| 500 | ₹ 59.19000 | ₹ 29,595.00 |
| 250 | ₹ 61.41000 | ₹ 15,352.50 |
| 100 | ₹ 64.47000 | ₹ 6,447.00 |
| 50 | ₹ 66.88000 | ₹ 3,344.00 |
| 25 | ₹ 69.37000 | ₹ 1,734.25 |
| 10 | ₹ 72.85000 | ₹ 728.50 |
| 1 | ₹ 82.39000 | ₹ 82.39 |
Stock:
Distributor: 11
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1540 | ₹ 61.41000 | ₹ 94,571.40 |
Stock:
Distributor: 111
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 500 | ₹ 74.52000 | ₹ 37,260.00 |
| 250 | ₹ 79.01000 | ₹ 19,752.50 |
| 75 | ₹ 90.94000 | ₹ 6,820.50 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 80.99000 | ₹ 80.99 |
| 10 | ₹ 71.47000 | ₹ 714.70 |
| 25 | ₹ 68.35000 | ₹ 1,708.75 |
| 50 | ₹ 65.86000 | ₹ 3,293.00 |
| 100 | ₹ 65.15000 | ₹ 6,515.00 |
| 250 | ₹ 61.77000 | ₹ 15,442.50 |
| 500 | ₹ 59.45000 | ₹ 29,725.00 |
| 1000 | ₹ 54.65000 | ₹ 54,650.00 |
| 2500 | ₹ 50.91000 | ₹ 1,27,275.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | HSB | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | BGA | |
| Mounting Technique | Adhesive (Not Included) | |
| Physical Shape Form | Square, Pin Fins | |
| Linear Length Dimension | 1.063" (27.00mm) | |
| Horizontal Width Dimension | 1.063" (27.00mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.236" (6.00mm) | |
| Power at Temp Increase | 3.8W @ 75°C | |
| Thermal Resistance with Fan | 7.80°C/W @ 200 LFM | |
| Passive Cooling Resistance | 19.59°C/W | |
| Construction Material Type | Aluminum Alloy | |
| Surface Material Treatment | Black Anodized |
Description
Fastened using a Adhesive (Not Included) method for dependable placement. Records the fin height at 0.236" (6.00mm). Overall length 1.063" (27.00mm) for size indication. Type of construction material Aluminum Alloy for durability and efficiency. Coating Black Anodized for safeguarding and aesthetic enhancement. Type of housing Box for safeguarding or transporting components. Layout of the thermal management package BGA aimed at cooling. Power dissipation at increased temperature 3.8W @ 75°C for device longevity. Product status Active concerning availability and lifecycle. Classification series for the product or component HSB. Shape Square, Pin Fins for the part or device. Thermal resistance with fan assistance 7.80°C/W @ 200 LFM for enhanced cooling efficiency. Thermal resistance in natural airflow 19.59°C/W for heat regulation. Type classification Top Mount for specifications. Horizontal width measurement 1.063" (27.00mm).
