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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Device Type Classification | Top Mount Kit | |
| Thermal Package Design | Rock Pi 4 | |
| Mounting Technique | Bolt On, Thermal Material | |
| Physical Shape Form | Rectangular | |
| Linear Length Dimension | - | |
| Horizontal Width Dimension | - | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | - | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | - | |
| Passive Cooling Resistance | - | |
| Construction Material Type | - | |
| Surface Material Treatment | - |
Description
Fastened using a Bolt On, Thermal Material method for dependable placement. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Type of housing Bulk for safeguarding or transporting components. Layout of the thermal management package Rock Pi 4 aimed at cooling. Product status Obsolete concerning availability and lifecycle. Shape Rectangular for the part or device. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Type classification Top Mount Kit for specifications. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications.
