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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | - | |
| Mounting Technique | Adhesive | |
| Physical Shape Form | Square, Fins | |
| Linear Length Dimension | 0.750" (19.05mm) | |
| Horizontal Width Dimension | 0.750" (19.05mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.205" (5.21mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | - | |
| Passive Cooling Resistance | - | |
| Construction Material Type | - | |
| Surface Material Treatment | - |
Description
Fastened using a Adhesive method for dependable placement. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Records the fin height at 0.205" (5.21mm). Overall length 0.750" (19.05mm) for size indication. Type of housing Bulk for safeguarding or transporting components. Product status Obsolete concerning availability and lifecycle. Shape Square, Fins for the part or device. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Type classification Top Mount for specifications. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications. Horizontal width measurement 0.750" (19.05mm).
