Attribute
Description
Manufacturer Part Number
655-53ABT3
Manufacturer
Description
HEATSINK FOR 40MM BGA
Manufacturer Lead Time
--
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 115

Quantity Unit Price Ext. Price
7500 ₹ 168.21000 ₹ 12,61,575.00
5000 ₹ 170.88000 ₹ 8,54,400.00
2500 ₹ 173.55000 ₹ 4,33,875.00
1000 ₹ 194.91000 ₹ 1,94,910.00
500 ₹ 199.36000 ₹ 99,680.00
250 ₹ 203.81000 ₹ 50,952.50
50 ₹ 211.82000 ₹ 10,591.00
10 ₹ 233.18000 ₹ 2,331.80

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
250 ₹ 306.18000 ₹ 76,545.00
130 ₹ 323.74000 ₹ 42,086.20
50 ₹ 344.40000 ₹ 17,220.00
30 ₹ 363.73000 ₹ 10,911.90
20 ₹ 403.92000 ₹ 8,078.40

Product Attributes

Type Description
Category
Import Duty Classification Tariff may apply if shipping to the United States
Product Series Line 655
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Top Mount
Thermal Package Design Assorted (BGA, LGA, CPU, ASIC...)
Mounting Technique Thermal Tape, Adhesive (Not Included)
Physical Shape Form Square, Pin Fins
Linear Length Dimension 1.600" (40.64mm)
Horizontal Width Dimension 1.600" (40.64mm)
Circular Measurement -
Heat Sink Fin Elevation 0.525" (13.34mm)
Power at Temp Increase 4.0W @ 40°C
Thermal Resistance with Fan 2.00°C/W @ 400 LFM
Passive Cooling Resistance -
Construction Material Type Aluminum
Surface Material Treatment Black Anodized