Attribute
Description
Manufacturer Part Number
A18213-14
Manufacturer
Description
THERM PAD 229MMX229MM GRAY
Manufacturer Lead Time
1 week
Note :
GST will not be applied to orders shipping outside of India
Stock:
Distributor: 116
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 40 | ₹ 34,059.80000 | ₹ 13,62,392.00 |
| 20 | ₹ 34,237.20000 | ₹ 6,84,744.00 |
| 10 | ₹ 35,698.75000 | ₹ 3,56,987.50 |
| 6 | ₹ 35,882.76000 | ₹ 2,15,296.56 |
| 4 | ₹ 36,066.78000 | ₹ 1,44,267.12 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 4 | ₹ 36,877.71000 | ₹ 1,47,510.84 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 40,372.18000 | ₹ 40,372.18 |
| 10 | ₹ 37,539.31000 | ₹ 3,75,393.10 |
Stock:
Distributor: 114
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 2 | ₹ 40,546.62000 | ₹ 81,093.24 |
| 5 | ₹ 38,704.32000 | ₹ 1,93,521.60 |
| 10 | ₹ 37,021.33000 | ₹ 3,70,213.30 |
| 25 | ₹ 35,478.96000 | ₹ 8,86,974.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Tflex™ SF10 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Usage Scenario | - | |
| Device Type Classification | Gap Filler Pad, Sheet | |
| Physical Shape Form | Square | |
| Dimensional Outline Drawing | 229.00mm x 229.00mm | |
| Material Thickness Gauge | 0.138" (3.50mm) | |
| Construction Material Type | Non-Silicone, Ceramic Filled | |
| Bonding Agent Type | - | |
| Support Layer Material | - | |
| Visual Hue | Gray | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | 10W/m-K |
Description
Offered in a shade referred to as Gray to enhance the system's aesthetics. Type of construction material Non-Silicone, Ceramic Filled for durability and efficiency. Shape outline 229.00mm x 229.00mm for device design and footprint. Type of housing Bulk for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Classification series for the product or component Tflex™ SF10. Shape Square for the part or device. Thermal conductivity coefficient 10W/m-K for effective heat transfer. Measurement of thickness 0.138" (3.50mm) for material or component dimensions. Type classification Gap Filler Pad, Sheet for specifications.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD