Attribute
Description
Manufacturer Part Number
HS75-TP2
Manufacturer
Description
THERM PAD 48.7X47.5MM BLUE
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 122

Quantity Unit Price Ext. Price
1000 ₹ 198.47000 ₹ 1,98,470.00
500 ₹ 205.77000 ₹ 1,02,885.00
250 ₹ 213.16000 ₹ 53,290.00
100 ₹ 222.77000 ₹ 22,277.00
50 ₹ 230.51000 ₹ 11,525.50
25 ₹ 238.43000 ₹ 5,960.75

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
3 ₹ 238.43000 ₹ 715.29

Product Attributes

Type Description
Category
Import Duty Classification Tariff may apply if shipping to the United States
Product Series Line HS
IC Encapsulation Type Bulk
Availability Status Active
Intended Usage Scenario IGBT - Heat Transfer Low Thermal Resistance
Device Type Classification Interface Pad, Sheet
Physical Shape Form Rectangular
Dimensional Outline Drawing 48.70mm x 47.50mm
Material Thickness Gauge 0.0200" (0.508mm)
Construction Material Type Silicone, Ceramic Filled
Bonding Agent Type Tacky - Both Sides
Support Layer Material -
Visual Hue Blue
Material Heat Resistance -
Heat Transfer Coefficient 3.0W/m-K

Description

Applies Tacky - Both Sides adhesive for strong and lasting bonding. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Offered in a shade referred to as Blue to enhance the system's aesthetics. Type of construction material Silicone, Ceramic Filled for durability and efficiency. Shape outline 48.70mm x 47.50mm for device design and footprint. Type of housing Bulk for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Classification series for the product or component HS. Shape Rectangular for the part or device. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Thermal conductivity coefficient 3.0W/m-K for effective heat transfer. Measurement of thickness 0.0200" (0.508mm) for material or component dimensions. Type classification Interface Pad, Sheet for specifications. Application IGBT - Heat Transfer Low Thermal Resistance for defined purpose or objective. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications.