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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | eGaN® | |
| IC Encapsulation Type | Tape & Reel (TR)Cut Tape (CT) | |
| Availability Status | Obsolete | |
| Core Technology Platform | GaNFET (Gallium Nitride) | |
| Setup Arrangement | 3 N-Channel (Half Bridge + Synchronous Bootstrap) | |
| Transistor Special Function | - | |
| Drain-Source Breakdown Volts | 60V, 100V | |
| Continuous Drain Current at 25C | 1.7A, 500mA | |
| Max On-State Resistance | 190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V | |
| Max Threshold Gate Voltage | 2.5V @ 100µA, 2.5V @ 20µA | |
| Max Gate Charge at Vgs | 0.22nC @ 5V, 0.044nC @ 5V | |
| Max Input Cap at Vds | 22pF @ 30V, 7pF @ 30V | |
| Maximum Power Handling | - | |
| Ambient Temp Range | -40°C ~ 150°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 9-VFBGA | |
| Vendor Package Type | 9-BGA (1.35x1.35) |
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