Attribute
Description
Manufacturer Part Number
BSM600D12P4G103
Manufacturer
Description
MOSFET 2N-CH 1200V 567A MODULE
Manufacturer Lead Time
18 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 117

Quantity Unit Price Ext. Price
1 ₹ 1,04,622.17000 ₹ 1,04,622.17

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 1,04,622.17000 ₹ 1,04,622.17

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
2 ₹ 1,15,215.50000 ₹ 2,30,431.00
1 ₹ 1,18,169.13000 ₹ 1,18,169.13

Stock:

Distributor: 130


Quantity Unit Price Ext. Price
1 ₹ 1,15,428.90000 ₹ 1,15,428.90

Stock:

Distributor: 113


Quantity Unit Price Ext. Price
4 ₹ 1,22,580.23000 ₹ 4,90,320.92

Stock:

Distributor: 118


Quantity Unit Price Ext. Price
1 ₹ 1,51,670.08000 ₹ 1,51,670.08

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Box
Availability Status Active
Core Technology Platform Silicon Carbide (SiC)
Setup Arrangement 2 N-Channel (Dual)
Transistor Special Function -
Drain-Source Breakdown Volts 1200V (1.2kV)
Continuous Drain Current at 25C 567A (Tc)
Max On-State Resistance -
Max Threshold Gate Voltage 4.8V @ 291.2mA
Max Gate Charge at Vgs -
Max Input Cap at Vds 59000pF @ 10V
Maximum Power Handling 1.78kW (Tc)
Ambient Temp Range 175°C (TJ)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Chassis Mount
Component Housing Style Module
Vendor Package Type Module

Description

Configured in a manner identified as 2 N-Channel (Dual). Is capable of sustaining a continuous drain current (Id) of 567A (Tc) at 25°C. Supports a Vdss drain-to-source voltage rated at 1200V (1.2kV). The maximum input capacitance reaches 59000pF @ 10V at Vds to protect the device. The input capacitance is specified at 59000pF @ 10V at Vds for peak performance. Mounting configuration Chassis Mount for structural stability. Temperature range 175°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Box for safeguarding or transporting components. Style of the enclosure/case Module that offers mechanical and thermal protection. Type of package Module that preserves the integrity of the device. Maximum power capability 1.78kW (Tc) for safeguarding the device. Product status Active concerning availability and lifecycle. Supplier package type Module for component selection. The primary technology platform Silicon Carbide (SiC) linked to the product category. Maximum Vgs(th) at Id 4.8V @ 291.2mA for MOSFET threshold specifications.