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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tape & Reel (TR) | |
| Availability Status | Obsolete | |
| Core Technology Platform | MOSFET (Metal Oxide) | |
| Setup Arrangement | 2 N-Channel (Half Bridge) | |
| Transistor Special Function | - | |
| Drain-Source Breakdown Volts | - | |
| Continuous Drain Current at 25C | - | |
| Max On-State Resistance | - | |
| Max Threshold Gate Voltage | 1.2V @ 200µA | |
| Max Gate Charge at Vgs | - | |
| Max Input Cap at Vds | 780pF @ 10V | |
| Maximum Power Handling | 500mW | |
| Ambient Temp Range | 150°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 4-XFLGA | |
| Vendor Package Type | 4-Chip LGA (1.59x1.59) |
Description
Configured in a manner identified as 2 N-Channel (Half Bridge). The maximum input capacitance reaches 780pF @ 10V at Vds to protect the device. The input capacitance is specified at 780pF @ 10V at Vds for peak performance. Mounting configuration Surface Mount for structural stability. Temperature range 150°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR) for safeguarding or transporting components. Style of the enclosure/case 4-XFLGA that offers mechanical and thermal protection. Type of package 4-Chip LGA (1.59x1.59) that preserves the integrity of the device. Maximum power capability 500mW for safeguarding the device. Product status Obsolete concerning availability and lifecycle. Supplier package type 4-Chip LGA (1.59x1.59) for component selection. The primary technology platform MOSFET (Metal Oxide) linked to the product category. Maximum Vgs(th) at Id 1.2V @ 200µA for MOSFET threshold specifications.
