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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | Microsoft Azure | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Assembly Kit Category | Starter Kit | |
| Primary Application Focus | IoT Kit | |
| Connection Network Design | Arduino R3 Shield, Intel Edison, Grove | |
| Recommended IDE Software | Arduino IDE, Eclipse IDE, Intel XDK | |
| Core Integrated Circuit | Atom™ | |
| Bundled Microcontroller Boards | Intel Edison |
Description
Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Includes Intel Edison MCU/MPU boards for integration into embedded systems. Offers a Arduino R3 Shield, Intel Edison, Grove connectivity structure for continuous access. Offers Starter Kit kit type tailored for its intended application. Main application IoT Kit for focused usage. Type of housing Bulk for safeguarding or transporting components. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component Microsoft Azure. Preferred coding environment Arduino IDE, Eclipse IDE, Intel XDK for development tasks. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. IC or component Atom™ utilized in circuit design. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications.
