Attribute
Description
Manufacturer Part Number
OM13491UL
Manufacturer
Description
SURFACE MOUNT TO DIP EVALUATION
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Assembly Kit Category Adapter, Breakout Boards
Item Quantity Available 42 Pieces (5 Values - Mixed Quantities)
Supported Package Formats HWSON, MSOP, SO, VSSOP, XQFN
Technical Specifications SMD to DIP
Switch Position Options 8

Description

Offers Adapter, Breakout Boards kit type tailored for its intended application. Overall number of positions 8 for switches or mechanical components. Type of housing Bulk for safeguarding or transporting components. Accepted package formats HWSON, MSOP, SO, VSSOP, XQFN for manufacturing or assembly. Quantity in stock 42 Pieces (5 Values - Mixed Quantities) for order fulfillment or inventory control. Information SMD to DIP for detailed product data.