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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | WM-R | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Core Technology Platform | Piezo | |
| Device Type Classification | General Purpose | |
| Operational Hz Spectrum | 400 Hz ~ 100 kHz | |
| Self-Resonance Frequency | - | |
| AC Resistance Value | - | |
| Noise Efficiency in dBA | 70.00 | |
| Tested Efficiency Metrics | 300mm | |
| Efficiency Measurement Method | Sound Pressure Level (SPL) | |
| Nominal Power Rating | - | |
| Maximum Power Handling | - | |
| Connection Port Placement | Top | |
| Physical Shape Form | Square | |
| Speaker Cone Material | - | |
| Magnetic Element Composition | - | |
| Dust Water Resistance Rating | - | |
| Performance Rating Specs | - | |
| Circuit End Method | Solder Pads | |
| Package Size Specs | 1.181" L x 1.181" W (30.00mm x 30.00mm) | |
| Maximum Mounted Height | 0.059" (1.50mm) |
Description
Includes efficiency metrics assessed at 300mm. Shows the type of efficiency identified as Sound Pressure Level (SPL). Records efficiency measured at 70.00 dBA. Offers a 400 Hz ~ 100 kHz frequency spectrum for broad-spectrum applications. Maximum installed height of 0.059" (1.50mm) for components affixed to the board. Type of housing Bulk for safeguarding or transporting components. The Top position of the port for installation reference. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component WM-R. Shape Square for the part or device. Details on package size 1.181" L x 1.181" W (30.00mm x 30.00mm) for electrical or mechanical components. Measurement dimensions 1.181" L x 1.181" W (30.00mm x 30.00mm) for component specifications. The primary technology platform Piezo linked to the product category. Termination method Solder Pads for electrical or mechanical connections. Type classification General Purpose for specifications.