Attribute
Description
Manufacturer Part Number
PA-SOD3SM18-14
Manufacturer
Description
SOCKET ADAPTER SOIC TO 14DIP
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Box
Availability Status Active
Prototype Board Style SMD to DIP
Supported Package Formats SOIC
Switch Position Options 14
Component Spacing Distance 0.050" (1.27mm)
Circuit Board Depth 0.031" (0.79mm) 1/32"
Construction Material Type -
Package Size Specs 0.750" L x 0.500" W (19.05mm x 12.70mm)

Description

Features a thickness of 0.031" (0.79mm) 1/32" to ensure strong structural integrity. Overall number of positions 14 for switches or mechanical components. Type of housing Box for safeguarding or transporting components. Accepted package formats SOIC for manufacturing or assembly. Distance 0.050" (1.27mm) for arranging components or aligning connectors. Product status Active concerning availability and lifecycle. Design of prototype board SMD to DIP for development tasks. Details on package size 0.750" L x 0.500" W (19.05mm x 12.70mm) for electrical or mechanical components. Measurement dimensions 0.750" L x 0.500" W (19.05mm x 12.70mm) for component specifications.