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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Central CPU Unit | XBurst® 1 | |
| Bus Core Width Bits | 1 Core, 32-Bit | |
| Operational Speed Rating | 1GHz | |
| Digital Signal Processors | - | |
| Memory Management Units | DDR2, LPDDR2, LVDDR2 | |
| GPU Speed Enhancement | No | |
| Screen and UI Processors | DVP, LCD, MIPI-CSI, RGB | |
| Network Ethernet Standard | 10/100Mbps (1) | |
| Serial ATA Interface | - | |
| USB Interface Version | USB 2.0 OTG (1) | |
| Input/Output Voltage Level | 1.8V, 3.3V | |
| Ambient Temp Range | -40°C ~ 85°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Data Protection Measures | AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2 | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 159-LFBGA | |
| Vendor Package Type | 159-BGA (9x9) | |
| Extra Connectivity Ports | AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART |
Description
Provides extra interface options rated at AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART to improve functionality. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Includes the core processor identified as XBurst® 1 for swift processing. Incorporates display and user interface processors noted as DVP, LCD, MIPI-CSI, RGB. Conforms to the Ethernet standard specified at 10/100Mbps (1). Offers a No boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 1 Core, 32-Bit for digital uses. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Voltage 1.8V, 3.3V for optimal output electric potential. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 159-LFBGA that offers mechanical and thermal protection. Type of package 159-BGA (9x9) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Units that control RAM DDR2, LPDDR2, LVDDR2 for effective memory management. Security features AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2 for device protection. Operational speed 1GHz for mechanical or data tasks. Supplier package type 159-BGA (9x9) for component selection. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Version of USB USB 2.0 OTG (1) for connectivity. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications. Input/output voltage level 1.8V, 3.3V for digital systems.
