Our team will assist you shortly.
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Central CPU Unit | XBurst® 2 | |
| Bus Core Width Bits | - | |
| Operational Speed Rating | 1.2GHz | |
| Digital Signal Processors | - | |
| Memory Management Units | LPDDR3 | |
| GPU Speed Enhancement | No | |
| Screen and UI Processors | DVP, LCD, MIPI-CSI, MIPI-DSI | |
| Network Ethernet Standard | 10/100/1000Mbps (1) | |
| Serial ATA Interface | - | |
| USB Interface Version | USB 2.0 OTG (1) | |
| Input/Output Voltage Level | 1.8V, 3.3V | |
| Ambient Temp Range | -40°C ~ 85°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Data Protection Measures | AES, RSA, TRNG, MD5, SHA, SHA2 | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 270-LFBGA | |
| Vendor Package Type | 270-BGA (12x12) | |
| Extra Connectivity Ports | DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG |
Description
Provides extra interface options rated at DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG to improve functionality. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Includes the core processor identified as XBurst® 2 for swift processing. Incorporates display and user interface processors noted as DVP, LCD, MIPI-CSI, MIPI-DSI. Conforms to the Ethernet standard specified at 10/100/1000Mbps (1). Offers a No boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Voltage 1.8V, 3.3V for optimal output electric potential. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 270-LFBGA that offers mechanical and thermal protection. Type of package 270-BGA (12x12) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Units that control RAM LPDDR3 for effective memory management. Security features AES, RSA, TRNG, MD5, SHA, SHA2 for device protection. Operational speed 1.2GHz for mechanical or data tasks. Supplier package type 270-BGA (12x12) for component selection. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Version of USB USB 2.0 OTG (1) for connectivity. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications. Input/output voltage level 1.8V, 3.3V for digital systems.
