Attribute
Description
Manufacturer Part Number
ASG000
Manufacturer
Description
KAROO BACKPACK FOR MORAY106
Manufacturer Lead Time
21 weeks
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Moray, Numbat | |
| IC Encapsulation Type | Box | |
| Availability Status | Obsolete | |
| Supported Hardware Platform | Moray | |
| Device Type Classification | Protoboard | |
| Primary Function Mode | Plated Through Hole | |
| Core Integrated Circuit | - | |
| Included Components | Board(s) |
Description
Contains internal parts categorized as Board(s). Engineered with Plated Through Hole features for versatile component usage. Type of housing Box for safeguarding or transporting components. The platform Moray for the integration of hardware systems. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component Moray, Numbat. Type classification Protoboard for specifications.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD