Attribute
Description
Manufacturer Part Number
ADSP-3PARCBF548M01
Manufacturer
Description
MODULE BOARD BF548
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line Blackfin®
IC Encapsulation Type Bulk
Expansion Board Category MPU Core
Central CPU Unit BF548
Auxiliary Processing Unit -
Operational Speed Rating 533MHz
Non-Volatile Flash Memory 32MB
Random Access Memory Bytes 64MB
Interface Connector Category SO-DIMM-200
Package Size Specs 2.240" L x 2.640" W (56.90mm x 67.00mm)
Ambient Temp Range -40°C ~ 85°C

Description

Features a connector type acknowledged as SO-DIMM-200. Includes the core processor identified as BF548 for swift processing. Indicates flash memory size evaluated at 32MB. Type of module or board MPU Core for system compatibility. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. The total size of RAM 64MB for system or device specifications. Classification series for the product or component Blackfin®. Details on package size 2.240" L x 2.640" W (56.90mm x 67.00mm) for electrical or mechanical components. Measurement dimensions 2.240" L x 2.640" W (56.90mm x 67.00mm) for component specifications. Operational speed 533MHz for mechanical or data tasks.