Description

Presents connection choices defined by I2C, IrDA, LINbus, SPI, UART/USART for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 16x12b; D/A 2x12b. Mounting configuration Surface Mount for structural stability. Overall I/O 80 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 100-LQFP that offers mechanical and thermal protection. Type of package 100-LQFP (14x14) that preserves the integrity of the device. Support for external devices DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 512KB (512K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 32K x 8 for system or device specifications. Classification series for the product or component STM32F1. Operational speed 24MHz for mechanical or data tasks. Supplier package type 100-LQFP (14x14) for component selection. Voltage requirement 2V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 2V ~ 3.6V for electronic devices.