Description

Utilizes a SAR architecture to improve effectiveness. Operates through a data interface specified at DSP, MICROWIRE™, QSPI™, and SPI™. Configured with Differential input type for diverse applications. Mounting configuration Surface Mount for structural stability. Number of A/D converters 1 for transforming analog signals into digital. Overall bits 20 ensuring digital precision. The total number of converters is 1 for power or signal transformation. Overall inputs 1 for sensors or equipment. Temperature range -40°C ~ 125°C for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 10-VFDFN Exposed Pad, CSP that offers mechanical and thermal protection. Type of package 10-LFCSP-WD (3x3) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Kind of reference External utilized for component identification. Signal capture rate of 1.8M. Supplier package type 10-LFCSP-WD (3x3) for component selection. Voltage supply 1.71V ~ 1.89V for the analog section of circuits. Voltage supplied to digital components 1.71V ~ 5.5V.