Description

Utilizes a SAR architecture to improve effectiveness. Configured in a manner identified as MUX-S/H-ADC. Operates through a data interface specified at SPI. Configured with Pseudo-Differential, Single Ended input type for diverse applications. Mounting configuration Surface Mount for structural stability. Number of A/D converters 1 for transforming analog signals into digital. Overall bits 10 ensuring digital precision. The total number of converters is 1 for power or signal transformation. Overall inputs 2, 4 for sensors or equipment. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 14-TSSOP (0.173", 4.40mm Width) that offers mechanical and thermal protection. Type of package 14-TSSOP that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Sample/hold to ADC ratio 1:1 for precise circuits. Kind of reference External utilized for component identification. Signal capture rate of 200k. Supplier package type 14-TSSOP for component selection. Voltage supply 2.7V ~ 5.5V for the analog section of circuits. Voltage supplied to digital components 2.7V ~ 5.5V.