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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | TC74LVX | |
| IC Encapsulation Type | Tape & Reel (TR) | |
| Availability Status | Obsolete | |
| Digital Logic Family | Buffer, Non-Inverting | |
| Component Element Total | 2 | |
| Bits per Data Element | 4 | |
| Entry Signal Category | - | |
| Exit Signal Category | 3-State | |
| High/Low Logic Current | 4mA, 4mA | |
| Power Supply Voltage | 2V ~ 3.6V | |
| Ambient Temp Range | -40°C ~ 85°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 20-TSSOP (0.173", 4.40mm Width) | |
| Vendor Package Type | 20-TSSOP |
Description
Facilitates a maximum output current level set as 4mA, 4mA. Offers information on high and low output current settings at 4mA, 4mA. The type of logic Buffer, Non-Inverting that guarantees maximum compatibility in electronic design. Mounting configuration Surface Mount for structural stability. Bits per data item 4 for memory or ADC precision. Total elements 2 present in circuits or arrays. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type 3-State for ensuring compatibility with output systems. Type of housing Tape & Reel (TR) for safeguarding or transporting components. Style of the enclosure/case 20-TSSOP (0.173", 4.40mm Width) that offers mechanical and thermal protection. Type of package 20-TSSOP that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component TC74LVX. Dimensions of the shell Buffer, Non-Inverting for connectors or enclosures. Supplier package type 20-TSSOP for component selection. Voltage requirement 2V ~ 3.6V for electrical specifications. Voltage supply 2V ~ 3.6V for device operation.
