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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tube | |
| Availability Status | Obsolete | |
| Device Type Classification | with Voltage Reference | |
| Component Element Total | 1 | |
| Exit Signal Category | CMOS, TTL | |
| Single or Dual Supply Option | 2.7V ~ 5.5V | |
| Max Input Offset Volts | 3.6mV | |
| Peak Bias Input Current | - | |
| Typical Output Amperage | - | |
| Maximum Idle Current | 750nA | |
| Typical Rejection Ratios | - | |
| Worst-Case Delay Time | 200µs | |
| Switching Threshold Gap | - | |
| Ambient Temp Range | -40°C ~ 125°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Component Housing Style | 8-WFDFN Exposed Pad | |
| Attachment Mounting Style | Surface Mount | |
| Vendor Package Type | 8-TDFN (3x3) |
Description
Provides maximum quiescent current of 750nA. Mounting configuration Surface Mount for structural stability. Total elements 1 present in circuits or arrays. Temperature range -40°C ~ 125°C for environmental conditions impacting thermal efficiency. Type CMOS, TTL for ensuring compatibility with output systems. Type of housing Tube for safeguarding or transporting components. Style of the enclosure/case 8-WFDFN Exposed Pad that offers mechanical and thermal protection. Type of package 8-TDFN (3x3) that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Maximum signal latency 200µs for critical timing. Supplier package type 8-TDFN (3x3) for component selection. Type classification with Voltage Reference for specifications. Maximum input offset voltage 3.6mV for precise circuits. Option to select between single or dual voltage supply ± 2.7V ~ 5.5V for different devices.
