Mounting configuration Surface Mount for structural stability. Overall I/O 27 for electronic connections. Overall LABs/CLBs 125 for FPGA configuration. Overall logic elements/cells 2000 for programmable hardware. Temperature range 0°C ~ 85°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 36-UFBGA, WLCSP that offers mechanical and thermal protection. Type of package 36-VBGA (3.47x3.4) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component MAX® 10. Supplier package type 36-VBGA (3.47x3.4) for component selection. Voltage requirement 1.15V ~ 1.25V for electrical specifications. Total RAM bits needed 110592 for memory specifications. Voltage supply 1.15V ~ 1.25V for device operation.
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