Mounting configuration Surface Mount for structural stability. Overall I/O 130 for electronic connections. Overall LABs/CLBs 125 for FPGA configuration. Overall logic elements/cells 2000 for programmable hardware. Temperature range 0°C ~ 85°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 169-LFBGA that offers mechanical and thermal protection. Type of package 169-UBGA (11x11) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component MAX® 10. Supplier package type 169-UBGA (11x11) for component selection. Voltage requirement 2.85V ~ 3.465V for electrical specifications. Total RAM bits needed 110592 for memory specifications. Voltage supply 2.85V ~ 3.465V for device operation.
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