Mounting configuration Surface Mount for structural stability. Overall I/O 300 for electronic connections. Overall LABs/CLBs 5125 for FPGA configuration. Overall logic elements/cells 65600 for programmable hardware. Temperature range -40°C ~ 100°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 676-BBGA, FCBGA that offers mechanical and thermal protection. Type of package 676-FCBGA (27x27) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component Kintex®-7. Supplier package type 676-FCBGA (27x27) for component selection. Voltage requirement 0.97V ~ 1.03V for electrical specifications. Total RAM bits needed 4976640 for memory specifications. Voltage supply 0.97V ~ 1.03V for device operation.
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