Description

Mounting configuration Surface Mount for structural stability. Overall I/O 17 for electronic connections. Overall LABs/CLBs 1484 for FPGA configuration. Overall logic elements/cells 5936 for programmable hardware. Temperature range -40°C ~ 100°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 36-UFBGA, WLCSP that offers mechanical and thermal protection. Type of package 36-WLCSP (2.54x2.59) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component CrossLink™. Supplier package type 36-WLCSP (2.54x2.59) for component selection. Voltage requirement 1.14V ~ 1.26V for electrical specifications. Total RAM bits needed 184320 for memory specifications. Voltage supply 1.14V ~ 1.26V for device operation.