Mounting configuration Surface Mount for structural stability. Overall I/O 40 for electronic connections. Overall LABs/CLBs 4250 for FPGA configuration. Overall logic elements/cells 17000 for programmable hardware. Temperature range -40°C ~ 100°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 72-BGA, WLCSP that offers mechanical and thermal protection. Type of package 72-WLCSP (3.7x4.1) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component CrossLink-NX™. Supplier package type 72-WLCSP (3.7x4.1) for component selection. Voltage requirement 0.95V ~ 1.05V for electrical specifications. Total RAM bits needed 442368 for memory specifications. Voltage supply 0.95V ~ 1.05V for device operation.
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