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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tube | |
| Availability Status | Obsolete | |
| Load Drive Setup | Low-Side | |
| Signal Path Design | Independent | |
| Output Driver Count | 2 | |
| Logic Gate Category | IGBT | |
| Power Supply Voltage | 4.5V ~ 35V | |
| Logic Low/High Voltage | 0.8V, 3V | |
| Peak Source/Sink Output | 3A, 3A | |
| Entry Signal Category | CMOS/TTL | |
| Max Bootstrap High Voltage | - | |
| Typical Edge Transition Time | 18ns, 18ns | |
| Ambient Temp Range | -55°C ~ 150°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Through Hole | |
| Component Housing Style | 8-DIP (0.300", 7.62mm) | |
| Vendor Package Type | 8-DIP |
Description
Organized by channel type referred to as Independent. Facilitates a maximum output current level set as 0.8V, 3V. Facilitates peak sourcing and sinking currents of 3A, 3A. Implements the driven arrangement described as Low-Side. Features IGBT gate type suitable for efficient transistor control. Configured with CMOS/TTL input type for diverse applications. The voltage levels VIL/VIH 0.8V, 3V required to meet digital input/output standards. Mounting configuration Through Hole for structural stability. Total drivers 2 responsible for managing circuits or systems. Temperature range -55°C ~ 150°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tube for safeguarding or transporting components. Style of the enclosure/case 8-DIP (0.300", 7.62mm) that offers mechanical and thermal protection. Type of package 8-DIP that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Typical rise and fall duration 18ns, 18ns for signal transitions. Supplier package type 8-DIP for component selection. Voltage requirement 4.5V ~ 35V for electrical specifications. Voltage supply 4.5V ~ 35V for device operation.
