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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tape & Reel (TR) | |
| Availability Status | Obsolete | |
| Load Drive Setup | Half-Bridge | |
| Signal Path Design | Synchronous | |
| Output Driver Count | 2 | |
| Logic Gate Category | MOSFET (N-Channel) | |
| Power Supply Voltage | 4.5V ~ 5.5V | |
| Logic Low/High Voltage | - | |
| Peak Source/Sink Output | 1A, 1A | |
| Entry Signal Category | Non-Inverting | |
| Max Bootstrap High Voltage | 30 V | |
| Typical Edge Transition Time | 30ns, 20ns | |
| Ambient Temp Range | -40°C ~ 125°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 8-SOIC (0.154", 3.90mm Width) | |
| Vendor Package Type | 8-SOIC |
Description
Organized by channel type referred to as Synchronous. Facilitates peak sourcing and sinking currents of 1A, 1A. Implements the driven arrangement described as Half-Bridge. Features MOSFET (N-Channel) gate type suitable for efficient transistor control. Supports a maximum high-side voltage of 30 V in bootstrap applications. Configured with Non-Inverting input type for diverse applications. Mounting configuration Surface Mount for structural stability. Total drivers 2 responsible for managing circuits or systems. Temperature range -40°C ~ 125°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR) for safeguarding or transporting components. Style of the enclosure/case 8-SOIC (0.154", 3.90mm Width) that offers mechanical and thermal protection. Type of package 8-SOIC that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Typical rise and fall duration 30ns, 20ns for signal transitions. Supplier package type 8-SOIC for component selection. Voltage requirement 4.5V ~ 5.5V for electrical specifications. Voltage supply 4.5V ~ 5.5V for device operation.
