Description

Presents connection choices defined by I2C, SPI for seamless integration. Includes the core processor identified as M8C for swift processing. Designed with core dimensions specified as 8-Bit. Comprises data converters classified as A/D 1x10b. Mounting configuration Surface Mount for structural stability. Overall I/O 13 for electronic connections. Temperature range 0°C ~ 70°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 16-UFQFN that offers mechanical and thermal protection. Type of package 16-QFN (3x3) that preserves the integrity of the device. Support for external devices LVD, POR, WDT for system integration and improvement. Product status Obsolete concerning availability and lifecycle. Firmware storage size 8KB (8K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 1K x 8 for system or device specifications. Classification series for the product or component enCoRe™ V CY7C604xx. Operational speed 24MHz for mechanical or data tasks. Supplier package type 16-QFN (3x3) for component selection. Voltage requirement 1.71V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 1.71V ~ 3.6V for electronic devices.