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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | PIC® XLP™ 16F | |
| IC Encapsulation Type | Tube | |
| Availability Status | Obsolete | |
| Central CPU Unit | PIC | |
| Processor Core Dimensions | 8-Bit | |
| Operational Speed Rating | 32MHz | |
| Interconnect Options | I2C, LINbus, SPI, UART/USART | |
| External Device Support | Brown-out Detect/Reset, POR, PWM, WDT | |
| Input/Output Port Count | 12 | |
| Firmware Storage Capacity | 14KB (8K x 14) | |
| Code Storage Technology | FLASH | |
| Non-Volatile Memory Capacity | - | |
| Random Access Memory Bytes | 1K x 8 | |
| Core Supply Voltage | 1.8V ~ 3.6V | |
| Analog-Digital Transformers | A/D 8x10b; D/A 1x8b | |
| Frequency Generator Category | Internal | |
| Ambient Temp Range | -40°C ~ 125°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Vendor Package Type | 16-UQFN (4x4) | |
| Component Housing Style | 16-UQFN Exposed Pad |
Description
Presents connection choices defined by I2C, LINbus, SPI, UART/USART for seamless integration. Includes the core processor identified as PIC for swift processing. Designed with core dimensions specified as 8-Bit. Comprises data converters classified as A/D 8x10b; D/A 1x8b. Mounting configuration Surface Mount for structural stability. Overall I/O 12 for electronic connections. Temperature range -40°C ~ 125°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tube for safeguarding or transporting components. Style of the enclosure/case 16-UQFN Exposed Pad that offers mechanical and thermal protection. Type of package 16-UQFN (4x4) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, POR, PWM, WDT for system integration and improvement. Product status Obsolete concerning availability and lifecycle. Firmware storage size 14KB (8K x 14) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 1K x 8 for system or device specifications. Classification series for the product or component PIC® XLP™ 16F. Operational speed 32MHz for mechanical or data tasks. Supplier package type 16-UQFN (4x4) for component selection. Voltage requirement 1.8V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 1.8V ~ 3.6V for electronic devices.
