Description

Presents connection choices defined by I2C, SPI, UART/USART for seamless integration. Includes the core processor identified as ARM® Cortex®-M0+ for swift processing. Designed with core dimensions specified as 32-Bit. Mounting configuration Surface Mount for structural stability. Overall I/O 14 for electronic connections. Temperature range -40°C ~ 105°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 16-XFDFN that offers mechanical and thermal protection. Type of package 16-XSON (3.2x2.5) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, POR, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 16KB (16K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 4K x 8 for system or device specifications. Classification series for the product or component LPC81xM. Operational speed 30MHz for mechanical or data tasks. Supplier package type 16-XSON (3.2x2.5) for component selection. Voltage requirement 1.8V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 1.8V ~ 3.6V for electronic devices.