Description

Presents connection choices defined by CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB OTG for seamless integration. Includes the core processor identified as ARM® Cortex®-M4 for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 16x12b. Mounting configuration Surface Mount for structural stability. Overall I/O 50 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 64-UFBGA, WLCSP that offers mechanical and thermal protection. Type of package 64-WLCSP (3.62x3.65) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 512KB (512K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 256K x 8 for system or device specifications. Classification series for the product or component STM32F4. Operational speed 100MHz for mechanical or data tasks. Supplier package type 64-WLCSP (3.62x3.65) for component selection. Voltage requirement 1.7V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 1.7V ~ 3.6V for electronic devices.