Description

Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Presents connection choices defined by I2C, IrDA, LINbus, SPI, UART/USART, USB for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 20x12b; D/A 2x12b. Represents EEPROM capacity measured at 4K x 8. Mounting configuration Surface Mount for structural stability. Overall I/O 51 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 64-LQFP that offers mechanical and thermal protection. Type of package 64-LQFP (10x10) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, Cap Sense, DMA, I2S, POR, PWM, WDT for system integration and improvement. Product status Not For New Designs concerning availability and lifecycle. Firmware storage size 128KB (128K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 16K x 8 for system or device specifications. Classification series for the product or component STM32L1. Operational speed 32MHz for mechanical or data tasks. Supplier package type 64-LQFP (10x10) for component selection. Voltage requirement 1.8V ~ 3.6V for electrical specifications. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications. Vcc/Vdd voltage supply 1.8V ~ 3.6V for electronic devices.