Description

Presents connection choices defined by I2C, IrDA, LINbus, SPI, UART/USART, USB for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 20x12b; D/A 2x12b. Represents EEPROM capacity measured at 4K x 8. Mounting configuration Surface Mount for structural stability. Overall I/O 51 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 64-LQFP that offers mechanical and thermal protection. Type of package 64-LQFP (10x10) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT for system integration and improvement. Product status Not For New Designs concerning availability and lifecycle. Firmware storage size 64KB (64K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 10K x 8 for system or device specifications. Classification series for the product or component STM32L1. Operational speed 32MHz for mechanical or data tasks. Supplier package type 64-LQFP (10x10) for component selection. Voltage requirement 1.8V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 1.8V ~ 3.6V for electronic devices.