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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | TX04 | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Central CPU Unit | ARM® Cortex®-M4F | |
| Processor Core Dimensions | 32-Bit | |
| Operational Speed Rating | 160MHz | |
| Interconnect Options | CEC, EBI/EMI, I2C, IrDA, SIO, SPI, SMIF, UART/USART | |
| External Device Support | DMA, LVD, POR, WDT | |
| Input/Output Port Count | 150 | |
| Firmware Storage Capacity | 1MB (1M x 8) | |
| Code Storage Technology | FLASH | |
| Non-Volatile Memory Capacity | 32K x 8 | |
| Random Access Memory Bytes | 192K x 8 | |
| Core Supply Voltage | 2.7V ~ 3.6V | |
| Analog-Digital Transformers | A/D 24x12b; D/A 2x8b | |
| Frequency Generator Category | Internal | |
| Ambient Temp Range | -40°C ~ 70°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Vendor Package Type | 100-LQFP (14x14) | |
| Component Housing Style | 100-LQFP |
Description
Presents connection choices defined by CEC, EBI/EMI, I2C, IrDA, SIO, SPI, SMIF, UART/USART for seamless integration. Includes the core processor identified as ARM® Cortex®-M4F for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 24x12b; D/A 2x8b. Represents EEPROM capacity measured at 32K x 8. Mounting configuration Surface Mount for structural stability. Overall I/O 150 for electronic connections. Temperature range -40°C ~ 70°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 100-LQFP that offers mechanical and thermal protection. Type of package 100-LQFP (14x14) that preserves the integrity of the device. Support for external devices DMA, LVD, POR, WDT for system integration and improvement. Product status Obsolete concerning availability and lifecycle. Firmware storage size 1MB (1M x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 192K x 8 for system or device specifications. Classification series for the product or component TX04. Operational speed 160MHz for mechanical or data tasks. Supplier package type 100-LQFP (14x14) for component selection. Voltage requirement 2.7V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 2.7V ~ 3.6V for electronic devices.
