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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Central CPU Unit | StrongARM | |
| Bus Core Width Bits | 1 Core, 32-Bit | |
| Operational Speed Rating | 200MHz | |
| Digital Signal Processors | Data; Microengine | |
| Memory Management Units | SDRAM | |
| GPU Speed Enhancement | No | |
| Screen and UI Processors | - | |
| Network Ethernet Standard | - | |
| Serial ATA Interface | - | |
| USB Interface Version | - | |
| Input/Output Voltage Level | 3.3V | |
| Ambient Temp Range | 0°C ~ 70°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Data Protection Measures | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 520-LFBGA | |
| Vendor Package Type | 520-HL-PBGA (40x40) | |
| Extra Connectivity Ports | - |
Description
Includes co-processing or DSP components classified as Data; Microengine. Includes the core processor identified as StrongARM for swift processing. Offers a No boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 1 Core, 32-Bit for digital uses. Temperature range 0°C ~ 70°C (TA) for environmental conditions impacting thermal efficiency. Voltage 3.3V for optimal output electric potential. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 520-LFBGA that offers mechanical and thermal protection. Type of package 520-HL-PBGA (40x40) that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Units that control RAM SDRAM for effective memory management. Operational speed 200MHz for mechanical or data tasks. Supplier package type 520-HL-PBGA (40x40) for component selection. Input/output voltage level 3.3V for digital systems.
