Description

Provides extra interface options rated at CAN, I2C, I2S, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI to improve functionality. Includes co-processing or DSP components classified as Multimedia; NEON™ MPE. Includes the core processor identified as ARM® Cortex®-A9 for swift processing. Incorporates display and user interface processors noted as LCD, LVDS, MIPICSI2, Video. Offers a Yes boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 1 Core, 32-Bit for digital uses. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 324-FBGA that offers mechanical and thermal protection. Type of package 324-FBGA (19x19) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Security features AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 for device protection. Classification series for the product or component RZ/A2M. Operational speed 528MHz for mechanical or data tasks. Supplier package type 324-FBGA (19x19) for component selection. Version of USB USB 2.0 (1) for connectivity.