Stock:
Distributor: 128
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1904 | ₹ 797.44000 | ₹ 15,18,325.76 |
| 952 | ₹ 834.82000 | ₹ 7,94,748.64 |
| 238 | ₹ 851.73000 | ₹ 2,02,711.74 |
| 119 | ₹ 883.77000 | ₹ 1,05,168.63 |
| 100 | ₹ 987.90000 | ₹ 98,790.00 |
| 50 | ₹ 1,032.40000 | ₹ 51,620.00 |
| 10 | ₹ 1,130.30000 | ₹ 11,303.00 |
| 5 | ₹ 1,379.50000 | ₹ 6,897.50 |
| 1 | ₹ 1,459.60000 | ₹ 1,459.60 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | RZ/N2L | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Central CPU Unit | ARM® Cortex®-R52 | |
| Bus Core Width Bits | 1 Core, 32-Bit | |
| Operational Speed Rating | 300MHz, 400MHz | |
| Digital Signal Processors | Multimedia; NEON™ SIMD | |
| Memory Management Units | - | |
| GPU Speed Enhancement | No | |
| Screen and UI Processors | - | |
| Network Ethernet Standard | 10/100/1000Mbps (1) | |
| Serial ATA Interface | - | |
| USB Interface Version | USB 2.0 (1) | |
| Input/Output Voltage Level | 1.8V, 3.3V | |
| Ambient Temp Range | -40°C ~ 125°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Data Protection Measures | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 225-LFBGA | |
| Vendor Package Type | 225-FBGA (13x13) | |
| Extra Connectivity Ports | CANbus, I2C, SCI, SPI, WDT |
Description
Provides extra interface options rated at CANbus, I2C, SCI, SPI, WDT to improve functionality. Includes co-processing or DSP components classified as Multimedia; NEON™ SIMD. Includes the core processor identified as ARM® Cortex®-R52 for swift processing. Conforms to the Ethernet standard specified at 10/100/1000Mbps (1). Offers a No boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 1 Core, 32-Bit for digital uses. Temperature range -40°C ~ 125°C (TJ) for environmental conditions impacting thermal efficiency. Voltage 1.8V, 3.3V for optimal output electric potential. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 225-LFBGA that offers mechanical and thermal protection. Type of package 225-FBGA (13x13) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component RZ/N2L. Operational speed 300MHz, 400MHz for mechanical or data tasks. Supplier package type 225-FBGA (13x13) for component selection. Version of USB USB 2.0 (1) for connectivity. Input/output voltage level 1.8V, 3.3V for digital systems.
