Employs supply current defined as 900 µA. Configured with CMOS, LVDS input type for diverse applications. Mounting configuration Surface Mount for structural stability. Temperature range -25°C ~ 105°C (TA) for environmental conditions impacting thermal efficiency. Type SPI for ensuring compatibility with output systems. Type of housing Cut Tape (CT)Digi-Reel®Bulk for safeguarding or transporting components. Style of the enclosure/case 32-VFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 32-QFN (4x4) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type 32-QFN (4x4) for component selection. Type classification Time to Flight to Digital Converter for specifications.
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