Stock:
Distributor: 157
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 304 | ₹ 2,364.73000 | ₹ 7,18,877.92 |
| 152 | ₹ 2,561.42000 | ₹ 3,89,335.84 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 250 | ₹ 2,445.26000 | ₹ 6,11,315.00 |
| 100 | ₹ 2,529.53000 | ₹ 2,52,953.00 |
| 50 | ₹ 2,594.46000 | ₹ 1,29,723.00 |
| 25 | ₹ 2,660.21000 | ₹ 66,505.25 |
| 10 | ₹ 2,747.96000 | ₹ 27,479.60 |
| 1 | ₹ 2,969.93000 | ₹ 2,969.93 |
Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ₹ 2,672.67000 | ₹ 2,672.67 |
| 10 | ₹ 2,473.31000 | ₹ 24,733.10 |
| 25 | ₹ 2,394.99000 | ₹ 59,874.75 |
| 50 | ₹ 2,382.53000 | ₹ 1,19,126.50 |
| 100 | ₹ 2,322.90000 | ₹ 2,32,290.00 |
| 250 | ₹ 2,200.08000 | ₹ 5,50,020.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | e•MMC™ | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | FLASH | |
| Core Technology Platform | FLASH - NAND (TLC) | |
| Total Memory Bytes | 512Gbit | |
| Storage Layout Structure | 64G x 8 | |
| Data Access Bus | eMMC_5.1 | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | - | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 153-WFBGA | |
| Vendor Package Type | 153-FBGA (11.5x13) |
Description
Media format FLASH for data compatibility. Memory interface eMMC_5.1 for performance and connectivity. Memory configuration 64G x 8 for efficient data access. Total memory size 512Gbit for device storage capability. Memory type Non-Volatile for efficiency and compatibility. Mounting configuration Surface Mount for structural stability. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 153-WFBGA that offers mechanical and thermal protection. Type of package 153-FBGA (11.5x13) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component e•MMC™. Supplier package type 153-FBGA (11.5x13) for component selection. The primary technology platform FLASH - NAND (TLC) linked to the product category.
