Media format FLASH for data compatibility. Memory interface UFS 3.1 for performance and connectivity. Total memory size 2Tbit for device storage capability. Memory type Non-Volatile for efficiency and compatibility. Mounting configuration Surface Mount for structural stability. Temperature range -25°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 153-VFBGA that offers mechanical and thermal protection. Type of package 153-FBGA (11.5x13) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type 153-FBGA (11.5x13) for component selection. Voltage requirement 1.14 ~ 1.26V, 1.2V, 2.4 ~ 2.7V, 2.5V for electrical specifications. The primary technology platform FLASH - NAND linked to the product category. Voltage supply 1.14 ~ 1.26V, 1.2V, 2.4 ~ 2.7V, 2.5V for device operation.
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