Stock:
Distributor: 111
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 304 | ₹ 1,791.57000 | ₹ 5,44,637.28 |
| 250 | ₹ 1,810.26000 | ₹ 4,52,565.00 |
| 152 | ₹ 1,833.40000 | ₹ 2,78,676.80 |
| 100 | ₹ 1,852.09000 | ₹ 1,85,209.00 |
| 50 | ₹ 1,892.14000 | ₹ 94,607.00 |
| 25 | ₹ 1,914.39000 | ₹ 47,859.75 |
| 10 | ₹ 1,993.60000 | ₹ 19,936.00 |
| 1 | ₹ 2,047.89000 | ₹ 2,047.89 |
Stock:
Distributor: 122
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 304 | ₹ 1,791.57000 | ₹ 5,44,637.28 |
| 250 | ₹ 1,810.26000 | ₹ 4,52,565.00 |
| 152 | ₹ 1,833.40000 | ₹ 2,78,676.80 |
| 100 | ₹ 1,852.09000 | ₹ 1,85,209.00 |
| 50 | ₹ 1,892.14000 | ₹ 94,607.00 |
| 25 | ₹ 1,914.39000 | ₹ 47,859.75 |
| 10 | ₹ 1,993.60000 | ₹ 19,936.00 |
| 1 | ₹ 2,047.89000 | ₹ 2,047.89 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | FLASH | |
| Core Technology Platform | FLASH - NAND (TLC) | |
| Total Memory Bytes | 1Tbit | |
| Storage Layout Structure | 128G x 8 | |
| Data Access Bus | eMMC | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | - | |
| Ambient Temp Range | -25°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 153-WFBGA | |
| Vendor Package Type | 153-FBGA (11.5x13) |
Description
Media format FLASH for data compatibility. Memory interface eMMC for performance and connectivity. Memory configuration 128G x 8 for efficient data access. Total memory size 1Tbit for device storage capability. Memory type Non-Volatile for efficiency and compatibility. Mounting configuration Surface Mount for structural stability. Temperature range -25°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 153-WFBGA that offers mechanical and thermal protection. Type of package 153-FBGA (11.5x13) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type 153-FBGA (11.5x13) for component selection. The primary technology platform FLASH - NAND (TLC) linked to the product category.
