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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | I-Temp e•MMC™ | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | FLASH | |
| Core Technology Platform | FLASH - NAND (TLC) | |
| Total Memory Bytes | 256Gbit | |
| Storage Layout Structure | 32G x 8 | |
| Data Access Bus | eMMC | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | 1.8V, 3.3V | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 153-WFBGA | |
| Vendor Package Type | 153-FBGA (11.5x13) |
Description
Media format FLASH for data compatibility. Memory interface eMMC for performance and connectivity. Memory configuration 32G x 8 for efficient data access. Total memory size 256Gbit for device storage capability. Memory type Non-Volatile for efficiency and compatibility. Mounting configuration Surface Mount for structural stability. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 153-WFBGA that offers mechanical and thermal protection. Type of package 153-FBGA (11.5x13) that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component I-Temp e•MMC™. Supplier package type 153-FBGA (11.5x13) for component selection. Voltage requirement 1.8V, 3.3V for electrical specifications. The primary technology platform FLASH - NAND (TLC) linked to the product category. Voltage supply 1.8V, 3.3V for device operation.
