Stock:
Distributor: 122
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 456 | ₹ 511.13000 | ₹ 2,33,075.28 |
| 250 | ₹ 511.75000 | ₹ 1,27,937.50 |
| 100 | ₹ 518.87000 | ₹ 51,887.00 |
| 50 | ₹ 520.47000 | ₹ 26,023.50 |
| 1 | ₹ 522.79000 | ₹ 522.79 |
Stock:
Distributor: 111
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 456 | ₹ 511.13000 | ₹ 2,33,075.28 |
| 250 | ₹ 511.75000 | ₹ 1,27,937.50 |
| 100 | ₹ 518.87000 | ₹ 51,887.00 |
| 50 | ₹ 520.47000 | ₹ 26,023.50 |
| 1 | ₹ 522.79000 | ₹ 522.79 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | FLASH | |
| Core Technology Platform | FLASH - NAND (TLC) | |
| Total Memory Bytes | 512Gbit | |
| Storage Layout Structure | 64G x 8 | |
| Data Access Bus | eMMC | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | - | |
| Ambient Temp Range | -25°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 153-WFBGA | |
| Vendor Package Type | 153-FBGA (11.5x13) |
Description
Media format FLASH for data compatibility. Memory interface eMMC for performance and connectivity. Memory configuration 64G x 8 for efficient data access. Total memory size 512Gbit for device storage capability. Memory type Non-Volatile for efficiency and compatibility. Mounting configuration Surface Mount for structural stability. Temperature range -25°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 153-WFBGA that offers mechanical and thermal protection. Type of package 153-FBGA (11.5x13) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type 153-FBGA (11.5x13) for component selection. The primary technology platform FLASH - NAND (TLC) linked to the product category.
