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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | RAM | |
| Core Technology Platform | MRAM (Magnetoresistive RAM) | |
| Total Memory Bytes | 4Mbit | |
| Storage Layout Structure | 256K x 16 | |
| Data Access Bus | Parallel | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | 35ns | |
| Data Retrieval Speed | 35 ns | |
| Power Supply Voltage | 3V ~ 3.6V | |
| Ambient Temp Range | 0°C ~ 70°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 44-TSOP (0.400", 10.16mm Width) | |
| Vendor Package Type | 44-TSOP II |
Description
Provides data access speeds of 35 ns for effective data retrieval. Media format RAM for data compatibility. Memory interface Parallel for performance and connectivity. Memory configuration 256K x 16 for efficient data access. Total memory size 4Mbit for device storage capability. Memory type Non-Volatile for efficiency and compatibility. Mounting configuration Surface Mount for structural stability. Temperature range 0°C ~ 70°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 44-TSOP (0.400", 10.16mm Width) that offers mechanical and thermal protection. Type of package 44-TSOP II that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Supplier package type 44-TSOP II for component selection. Voltage requirement 3V ~ 3.6V for electrical specifications. The primary technology platform MRAM (Magnetoresistive RAM) linked to the product category. Voltage supply 3V ~ 3.6V for device operation. Duration required to write each word or page 35ns for memory components.
