Our team will assist you shortly.
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Uses | LDO (Linear), DDR | |
| Supply Input Volts | 2.3V ~ 3.6V | |
| Signal Output Quantity | 1 | |
| Delivery Output Volts | Multiple | |
| Ambient Temp Range | -40°C ~ 125°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 16-TSSOP (0.173", 4.40mm Width) Exposed Pad | |
| Vendor Package Type | 16-TSSOP-EP |
Description
Perfectly designed for situations involving LDO (Linear), DDR. The input voltage established at 2.3V ~ 3.6V for reliable performance. Mounting configuration Surface Mount for structural stability. Overall outputs 1 for device connections. Temperature range -40°C ~ 125°C (TA) for environmental conditions impacting thermal efficiency. Voltage Multiple for optimal output electric potential. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 16-TSSOP (0.173", 4.40mm Width) Exposed Pad that offers mechanical and thermal protection. Type of package 16-TSSOP-EP that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type 16-TSSOP-EP for component selection. Current supply level 2.3V ~ 3.6V for electrical parameters. Input voltage 2.3V ~ 3.6V required for devices. The output voltage Multiple for electrical systems.
