Our team will assist you shortly.
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Uses | Converter, 3G, 3.5G, 4G RF Power Amplifier | |
| Supply Input Volts | 2.7V ~ 5.5V | |
| Signal Output Quantity | 1 | |
| Delivery Output Volts | 0.4V ~ 5.5V | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 9-UFBGA, WLCSP | |
| Vendor Package Type | 9-WLCSP (1.34x1.29) |
Description
Perfectly designed for situations involving Converter, 3G, 3.5G, 4G RF Power Amplifier. The input voltage established at 2.7V ~ 5.5V for reliable performance. Mounting configuration Surface Mount for structural stability. Overall outputs 1 for device connections. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Voltage 0.4V ~ 5.5V for optimal output electric potential. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 9-UFBGA, WLCSP that offers mechanical and thermal protection. Type of package 9-WLCSP (1.34x1.29) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type 9-WLCSP (1.34x1.29) for component selection. Current supply level 2.7V ~ 5.5V for electrical parameters. Input voltage 2.7V ~ 5.5V required for devices. The output voltage 0.4V ~ 5.5V for electrical systems.
